Microstructural, Mechanical, Electrical, and Thermal Properties of the Bi-Sn-Ag Ternary Eutectic Alloy
dc.authorid | Buyuk, Ugur/0000-0002-6830-8349 | |
dc.authorid | Engin, Sevda/0000-0001-8746-8770 | |
dc.contributor.author | Kaya, Hasan | |
dc.contributor.author | Engin, Sevda | |
dc.contributor.author | Aker, Aynur | |
dc.contributor.author | Buyuk, Ugur | |
dc.contributor.author | Cadirli, Emin | |
dc.date.accessioned | 2024-12-24T19:24:52Z | |
dc.date.available | 2024-12-24T19:24:52Z | |
dc.date.issued | 2017 | |
dc.department | Siirt Üniversitesi | |
dc.description.abstract | The development of lead-free solders has emerged as one of the key issues in the electronics packaging industries. Bi-Sn-Ag eutectic alloy has been considered as one of the lead-free solder materials that can replace the toxic Pb-Sn eutectic solder without increasing soldering temperature. We investigated the effects of temperature gradient and growth rate on the mechanical, electrical and thermal properties of the Bi-Sn-Ag ternary eutectic alloy. Bi-47 wt% Sn-0.68 wt% Ag alloy was directionally solidified upward with different temperature gradients ( G=2.33-5.66 K/mm) at a constant growth rate ( V=13.25 mu m/s) and with different growth rates ( V=6.55-132.83 mu m/s) at a constant temperature gradient ( G=2.33 K/mm) in the growth apparatus. The microstructures (lambda), microhardness ( HV), tensile stress ( sigma), electrical resistivity (rho), and thermal properties (Delta H, C-p, T-m) were measured on directionally solidified samples. The dependency of the lambda, HV, sigma, and rho on G and V was investigated. According to the experimental results, lambda values decrease with increasing G and V, but HV, lambda, and rho values increase with increasing G and V. Variations of electrical resistivity (rho) for cast samples with the temperature in the range of 300-400 K were also measured by using a standard dc four-point probe technique. The enthalpy of fusion (Delta H) and specific heat ( C-p) for the same alloy was also determined by means of differential scanning calorimeter ( DSC) from heating trace during the transformation from eutectic liquid to eutectic solid. | |
dc.description.sponsorship | Erciyes University Scientific Research Project Unit [FBA-10-3376] | |
dc.description.sponsorship | Supported by the Erciyes University Scientific Research Project Unit (No. FBA-10-3376) | |
dc.identifier.doi | 10.1007/s11595-017-1573-2 | |
dc.identifier.endpage | 154 | |
dc.identifier.issn | 1000-2413 | |
dc.identifier.issn | 1993-0437 | |
dc.identifier.issue | 1 | |
dc.identifier.scopus | 2-s2.0-85012215421 | |
dc.identifier.scopusquality | Q3 | |
dc.identifier.startpage | 147 | |
dc.identifier.uri | https://doi.org/10.1007/s11595-017-1573-2 | |
dc.identifier.uri | https://hdl.handle.net/20.500.12604/6163 | |
dc.identifier.volume | 32 | |
dc.identifier.wos | WOS:000397306200027 | |
dc.identifier.wosquality | Q4 | |
dc.indekslendigikaynak | Web of Science | |
dc.indekslendigikaynak | Scopus | |
dc.language.iso | en | |
dc.publisher | Wuhan Univ Technology | |
dc.relation.ispartof | Journal of Wuhan University of Technology-Materials Science Edition | |
dc.relation.publicationcategory | Makale - Uluslararası Hakemli Dergi - Kurum Öğretim Elemanı | |
dc.rights | info:eu-repo/semantics/closedAccess | |
dc.snmz | KA_20241222 | |
dc.subject | solidification | |
dc.subject | microhardness | |
dc.subject | tensile stress | |
dc.subject | electrical resistivity | |
dc.subject | enthalpy | |
dc.title | Microstructural, Mechanical, Electrical, and Thermal Properties of the Bi-Sn-Ag Ternary Eutectic Alloy | |
dc.type | Article |