Microstructural, Mechanical, Electrical, and Thermal Properties of the Bi-Sn-Ag Ternary Eutectic Alloy

dc.authoridBuyuk, Ugur/0000-0002-6830-8349
dc.authoridEngin, Sevda/0000-0001-8746-8770
dc.contributor.authorKaya, Hasan
dc.contributor.authorEngin, Sevda
dc.contributor.authorAker, Aynur
dc.contributor.authorBuyuk, Ugur
dc.contributor.authorCadirli, Emin
dc.date.accessioned2024-12-24T19:24:52Z
dc.date.available2024-12-24T19:24:52Z
dc.date.issued2017
dc.departmentSiirt Üniversitesi
dc.description.abstractThe development of lead-free solders has emerged as one of the key issues in the electronics packaging industries. Bi-Sn-Ag eutectic alloy has been considered as one of the lead-free solder materials that can replace the toxic Pb-Sn eutectic solder without increasing soldering temperature. We investigated the effects of temperature gradient and growth rate on the mechanical, electrical and thermal properties of the Bi-Sn-Ag ternary eutectic alloy. Bi-47 wt% Sn-0.68 wt% Ag alloy was directionally solidified upward with different temperature gradients ( G=2.33-5.66 K/mm) at a constant growth rate ( V=13.25 mu m/s) and with different growth rates ( V=6.55-132.83 mu m/s) at a constant temperature gradient ( G=2.33 K/mm) in the growth apparatus. The microstructures (lambda), microhardness ( HV), tensile stress ( sigma), electrical resistivity (rho), and thermal properties (Delta H, C-p, T-m) were measured on directionally solidified samples. The dependency of the lambda, HV, sigma, and rho on G and V was investigated. According to the experimental results, lambda values decrease with increasing G and V, but HV, lambda, and rho values increase with increasing G and V. Variations of electrical resistivity (rho) for cast samples with the temperature in the range of 300-400 K were also measured by using a standard dc four-point probe technique. The enthalpy of fusion (Delta H) and specific heat ( C-p) for the same alloy was also determined by means of differential scanning calorimeter ( DSC) from heating trace during the transformation from eutectic liquid to eutectic solid.
dc.description.sponsorshipErciyes University Scientific Research Project Unit [FBA-10-3376]
dc.description.sponsorshipSupported by the Erciyes University Scientific Research Project Unit (No. FBA-10-3376)
dc.identifier.doi10.1007/s11595-017-1573-2
dc.identifier.endpage154
dc.identifier.issn1000-2413
dc.identifier.issn1993-0437
dc.identifier.issue1
dc.identifier.scopus2-s2.0-85012215421
dc.identifier.scopusqualityQ3
dc.identifier.startpage147
dc.identifier.urihttps://doi.org/10.1007/s11595-017-1573-2
dc.identifier.urihttps://hdl.handle.net/20.500.12604/6163
dc.identifier.volume32
dc.identifier.wosWOS:000397306200027
dc.identifier.wosqualityQ4
dc.indekslendigikaynakWeb of Science
dc.indekslendigikaynakScopus
dc.language.isoen
dc.publisherWuhan Univ Technology
dc.relation.ispartofJournal of Wuhan University of Technology-Materials Science Edition
dc.relation.publicationcategoryMakale - Uluslararası Hakemli Dergi - Kurum Öğretim Elemanı
dc.rightsinfo:eu-repo/semantics/closedAccess
dc.snmzKA_20241222
dc.subjectsolidification
dc.subjectmicrohardness
dc.subjecttensile stress
dc.subjectelectrical resistivity
dc.subjectenthalpy
dc.titleMicrostructural, Mechanical, Electrical, and Thermal Properties of the Bi-Sn-Ag Ternary Eutectic Alloy
dc.typeArticle

Dosyalar