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    Öğe
    Al-Cu ÖTEKTİK ALAŞIMINA Ag, Zn VE Sn KATKILANMASININ MEKANİK VE ELEKTRİKSEL ÖZELLİKLERE ETKİSİNİN ARAŞTIRILMASI
    (2019) Korkmaz, Ayla; Nair, Fehmi; Yıldırım, İsmail; Kaya, Hasan
    Bu çalışmada, Al-Cu ötektik alaşımına %2 (ağ.) oranında Ag, Sn ve Zn metalleri katkılanarak elde edilen Al-%33Cu-%2x [x=Ag, x=Sn, x=Zn] (ağ.) alaşım sistemlerinin mikroyapı, mekanik ve elektriksel özellikleriaraştırılmıştır. Bu amaçla üçlü alaşımlar, belirlenen oranlardaki metallerin vakum ortamında eritilmesinden sonra,eriyik haldeki sıvı alaşımların döküm fırınındaki grafit potalara doldurularak hazırlanmıştır. Döküm halindekialaşımların, mikroyapı fotoğrafları taramalı elektron mikroskobu (SEM) yardımıyla çekilmiştir. Çekilen bufotoğraflardan, katkı elementlerinin mikroyapılara olan etkileri araştırılmıştır. Al-%33Cu-%2x alaşımlarınınkimyasal bileşim analizi EDX ile yapılmıştır. Döküm halindeki Al-%33Cu-%2x [x=Ag, x=Sn, x=Zn] (ağ.)alaşımları için mikrosertlik (HV) değerleri sırasıyla 184,6 kg/mm2, 144,2 kg/mm2 ve 136 kg/mm2, çekmedayanımı (?) değerleri 92 MPa, 72,7 MPa ve 53,7 MPa, elektriksel özdirenç (?) değerleri ise 2,13x10-8 ??,????x10-8 ?? ve ????x10-8 ?? olarak ölçülmüştür. Katkılama elementlerinin Al-Cu ötektiğinin mekanik veelektriksel özelliklerini etkilediği görülmüştür. Bu çalışmada bulunan deneysel sonuçlar, literatürdeki benzerçalışmaların sonuçları ile karşılaştırılmıştır.
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    Öğe
    Determination of Microstructure, Mechanical, Electrical and Thermal Properties of The Directionally Solidified Al-Si-Co Ternary Alloy
    (Univ Fed Sao Carlos, Dept Engenharia Materials, 2016) Aker, Aynur; Kaya, Hasan
    In this work, Al-12.6Si-2Co (wt.%) ternary alloy of near eutectic composition was directionally solidified at a constant temperature gradient (G=7.60 K/mm) in a wide range of growth rates (V=8.35-166.30 mu m/s) using by Bridgman type growth apparatus. Flake spacing (lambda), microhardness (HV), tensile stress (sigma) and electrical resistivity (rho) were measured from directionally solidified samples. The dependence of flake spacing, microhardness, tensile stress and electrical resistivity on growth rate (V) was also determined by statistical analysis. According to these results, it has been found that for increasing values of V, the values of HV; sigma and rho increase. Variations of electrical resistivity (rho) for casting Al-Si-Co alloy were also measured at the temperature in range 300-500 K. The enthalpy of fusion (Delta H) for the Al-Si-Co alloy was determined by differential scanning calorimeter (DSC) from heating trace during the transformation from solid to liquid. The results obtained in this work were compared with the previous similar experimental results obtained for binary and ternary alloys.
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    Öğe
    Effect of alloying elements and growth rates on microstructure and mechanical properties in the directionally solidified Al-Si-X alloys
    (Elsevier Science Sa, 2017) Kaya, Hasan; Aker, Aynur
    In this research, effect of alloying elements (X = Cu, Co, Ni, Sb and Bi) and growth rates on the microstructure and mechanical properties (microhardness and tensile strength) of the directionally solidified Al-Si eutectic alloy have been investigated. Al-12.6Si-2X (wt. %) samples were prepared using metals of 99.99% high purity in the vacuum atmosphere. These alloys were directionally solidified under constant temperature gradient and different growth rates (8.3-166.0 mu m/s) by using a Bridgman-type growth apparatus. Interflake spacings, microhardness and tensile strength were expressed as functions of growth rate. The effects of alloying elements and growth rates on microstructure, microhardness and tensile strength were determined. According to experimental results, the microstructures, microhardness and tensile strength of the solidified Al-Si-X samples changes with alloying elements (Cu, Co, Ni, Sb and Bi) and the growth rates. The results obtained in this work have been compared with the similar experimental research in the literature. (C) 2016 Elsevier B.V. All rights reserved.
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    Öğe
    Measurements of electrical and thermal properties with growth rate, alloying elements and temperature in the Al-Si-X alloys
    (Taylor & Francis Ltd, 2017) Aker, Aynur; Kaya, Hasan
    In this work, effect of alloying elements (X = Cu, Co, Ni, Sb and Bi) and growth rates on the microstructure, physical properties (electrical resistivity, enthalpy and specific heat) of the directionally solidified Al-Si eutectic alloy have been investigated. Al-12.6Si-2X (wt. %) samples were prepared using metals of 99.99% high purity in the vacuum atmosphere. These alloys were directionally solidified under constant temperature gradient, G (7.80K/mm) and different growth rates, V (8.3-166.0 mu m/s). Flake spacing (lambda) and electrical resistivity (rho) were measured from the solidified samples. The variation of electrical resistivity with temperature in the range of 300-500K for alloying elements in the Al-Si eutectic cast alloy was also measured. The enthalpy of fusion (Delta H) and specific heat (C-p) for the same alloy were determined by a differential scanning calorimeter from the heating curve during the transformation from solid to liquid.
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    Öğe
    Microstructural, Mechanical, Electrical, and Thermal Properties of the Bi-Sn-Ag Ternary Eutectic Alloy
    (Wuhan Univ Technology, 2017) Kaya, Hasan; Engin, Sevda; Aker, Aynur; Buyuk, Ugur; Cadirli, Emin
    The development of lead-free solders has emerged as one of the key issues in the electronics packaging industries. Bi-Sn-Ag eutectic alloy has been considered as one of the lead-free solder materials that can replace the toxic Pb-Sn eutectic solder without increasing soldering temperature. We investigated the effects of temperature gradient and growth rate on the mechanical, electrical and thermal properties of the Bi-Sn-Ag ternary eutectic alloy. Bi-47 wt% Sn-0.68 wt% Ag alloy was directionally solidified upward with different temperature gradients ( G=2.33-5.66 K/mm) at a constant growth rate ( V=13.25 mu m/s) and with different growth rates ( V=6.55-132.83 mu m/s) at a constant temperature gradient ( G=2.33 K/mm) in the growth apparatus. The microstructures (lambda), microhardness ( HV), tensile stress ( sigma), electrical resistivity (rho), and thermal properties (Delta H, C-p, T-m) were measured on directionally solidified samples. The dependency of the lambda, HV, sigma, and rho on G and V was investigated. According to the experimental results, lambda values decrease with increasing G and V, but HV, lambda, and rho values increase with increasing G and V. Variations of electrical resistivity (rho) for cast samples with the temperature in the range of 300-400 K were also measured by using a standard dc four-point probe technique. The enthalpy of fusion (Delta H) and specific heat ( C-p) for the same alloy was also determined by means of differential scanning calorimeter ( DSC) from heating trace during the transformation from eutectic liquid to eutectic solid.